Keywords | Philips Cantwell India Ultrasonic Soldering Adhesive Resin |
Ministry/ Department/ Residency | PATENTS AND DISGNS KOLKATA |
Branch | Kolkata |
From Year / Date (YYYY-MM-DD) |
1963 |
To Year / Date (YYYY-MM-DD) |
1963 |
Source Organization | NA |
Identifier | NAIBHF00008394 |
File No./Reference No./Sheet No./Folio No. | 86654 |
Location | BBSR-R1 |
Part No. | NA |
File Size | 26.8 MB |
Pages | 16 |
Call Number | NA |
Publisher | NA |
Subject | NA |
Creator | NA |
Accession Number | NA |
Series | NA |
Year of Publication | NA |
Language | English |
Bundle Barcode | NAIBHB00000317 |
Location Code | NA |
File Barcode | NAIBHF00008394 |
QC Certificate No. | QC_20240705BH |
Bundle No. | 125 |