Thermosetting and Heating to Method of Manufacturing Devices Having Soldering and Adhesive Joints

Keywords Philips
Cantwell
India
Ultrasonic
Soldering
Adhesive
Resin
Ministry/ Department/ Residency PATENTS AND DISGNS KOLKATA
Branch Kolkata
From Year / Date
(YYYY-MM-DD)
1963
To Year / Date
(YYYY-MM-DD)
1963
Source Organization NA
Identifier NAIBHF00008394
File No./Reference No./Sheet No./Folio No. 86654
Location BBSR-R1
Part No. NA
File Size 26.8 MB
Pages 16
Call Number NA
Publisher NA
Subject NA
Creator NA
Accession Number NA
Series NA
Year of Publication NA
Language English
Bundle Barcode NAIBHB00000317
Location Code NA
File Barcode NAIBHF00008394
QC Certificate No. QC_20240705BH
Bundle No. 125
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